ficonTEC is a recognized market leader for automated photonic packaging and testing systems for high-end opto-electronic components and PICs (photonics integrated circuits). Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more.
True to our ‘Photonics from Lab to Fab’ maxim, ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – regardless of whether for contract manufacturing or for in-house corporate R&D and production.
ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling over 600 machines, each one is the automated and optimized embodiment of a customer-defined process.