Centerline Technologies was founded in 2005 by Hugh Muffoletto to meet the growing demand for high-quality, ultra-precision surface finishing in the telecommunication, semiconductor, communication, micro-electronic, defense and security markets. Services include grinding, lapping, polishing, diamond sawing and laser machining of metals, ceramic, sapphire and other materials.
Centerline Technologies is dedicated to providing the highest quality services at the greatest value possible. We support this dedication with our operational systems, customer service, research, expertise and knowledge required to help our customers meet the demands and requirements they face everyday.
Centerline Technologies speacilizes in lapping, polishing, laser machining, diamond sawing and machining, and back lapping.
For applications that require a smoother, more parallel finish, Centerline provides the highest quality polishing services.